POWER SEMICONDUCTOR DEVICE

摘要

This invention is provided with: a circuit board which is placed in a package and in which an electric circuit including a power semiconductor element is formed; and a plurality of press-fit terminals each having a wire-bond portion electrically connected in the package to the electric circuit, a press-fit portion for making electrical connection with an apparatus to be connected, and a body portion whose one end portion continuous to the wire bond portion is internally fastened to the package and whose other end portion supports the press-fit portion so as to place the press-fit portion away from the package; wherein in each of the plurality of press-fit terminals, at a portion in the body portion exposed from the package, there is formed a constriction portion that is constricted from both sides in a direction perpendicular to the center line, so as to leave a portion around the center line.

主权项

1. A power semiconductor device, comprising:
a housing; a circuit board which is placed in the housing and in which an electric circuit including a power semiconductor element is formed; a plurality of terminals each having an inner terminal portion electrically connected in the housing to the electric circuit, an outer terminal portion for making electrical connection with an apparatus to be connected, and a body portion whose one end continuous to the inner terminal portion is fastened internally to the housing and which supports the outer terminal portion at the other end so as to place the outer terminal portion away from the housing; wherein, in each of the plurality of terminals, at a portion in the body portion exposed from the housing, there is formed a constriction portion that is concaved from both sides in a direction perpendicular to a center line that connects the outer terminal portion and a root portion in the portion exposed from the housing, so as to leave a portion around the center line.