| 摘要 |
Provided is a semiconductor device. In the semiconductor device, a rectangular header with two mounting regions is folded, and two semiconductor chips are then fixed respectively to the mounting regions facing each other. Thereby, a stacked structure of the semiconductor chips is achieved while a mounting area of a package remains the same as the area for one semiconductor chip of a conventional type. Furthermore, characteristics of the two semiconductor chips can be obtained. Accordingly, compared with a case in which one semiconductor chip is used, on-resistance is decreased due to an increase in the number of transistor cells. Thereby, the semiconductor device can be driven at a low voltage. In addition, a larger current capacity can be achieved. Moreover, compared with a case in which two semiconductor chips are mounted next to each other on the header, a mounting area of a package outline can be reduced.
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