发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device capable of supplying promptly a stable active species to a treating region of a work, when carrying out a plasma treatment to the work of which the treating region is established discontinuously. <P>SOLUTION: The plasma treatment device 1 is provided with a pair of electrodes 2, 3, a power supply circuit 7, a gas supply means 8, a plasma injection port 5, a shielding means capable of displacing a plasma shielding member 51 between a first state and a second state, and a control means. The control means controls operation of the shielding means and can switch over between a non-treating mode in which plasma treatment on a treatment surface 101 of the work 10 is stopped by making the plasma shielding member 51 into the first state and a treating mode in which the plasma treatment is carried out by contacting an active species on the treating surface 101 of the work 10 by making the plasma shielding member 51 into the second state. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008226628(A) 申请公布日期 2008.09.25
申请号 JP20070062686 申请日期 2007.03.12
申请人 SEIKO EPSON CORP 发明人 ASUKE SHINTARO
分类号 H05H1/24;B01J19/08;H01L21/3065 主分类号 H05H1/24
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