Method and system of classifying defects on a wafer

摘要

A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.

主权项

1. A method of classifying defects on a wafer, comprising:
receiving a defect-free image of a defect-free chip translating said defect-free image into a simulated layout that corresponds to a real layout of said defect-free chip, wherein said defect-free image has at least a pattern, and said simulated layout represents an outer border of said pattern and is generated by connecting first pixel and a second pixel and both said first pixel and said second pixel are located on said outer border of said pattern; receiving a first image of a first chip; examining said first image for determining said first chip having a defect; and comparing said first image with said simulated layout to classify said defect on said first chip when said first chip is determined having said defect.