| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminated film having high adhesive strength, reduced in warpage and curling and improved in migration-resistant characteristics, and a method for manufacturing the copper-clad laminated film simply, economically and stably. SOLUTION: The copper-clad laminated film is constituted by a laminate of an organic solvent soluble polyimide layer with a coefficient of linear thermal expansion of 10-25 ppm/°C and a thickness of 1-100μm and a copper foil with a thickness of 1-250μm without interposing an adhesive. COPYRIGHT: (C)2008,JPO&INPIT |
