| 发明名称 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | ||
| 摘要 | A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity. | ||
| 申请公布号 | US9475691(B1) | 申请公布日期 | 2016.10.25 |
| 申请号 | US201514751316 | 申请日期 | 2015.06.26 |
| 申请人 | Infineon Technologies AG | 发明人 | Chua Kok Yau;Chan Sook Woon;Chiang Chau Fatt;Martens Stefan;Steiert Matthias;Yeo Kian Hong;Chua Hock Siang;Ng Mei Chin;Lee Swee Kah |
| 分类号 | H01L23/495;B81B7/00;B81C1/00 | 主分类号 | H01L23/495 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A semiconductor package, comprising: an electrically conductive lead-frame, comprising a first die paddle having a first opening, and a plurality of electrically conductive leads; a ridge formed around a perimeter of the first opening; and an electrically insulating molding compound, comprising an interior cavity being defined by a planar base surface and outer sidewalls of the molding compound, a second opening formed in the base surface, and an interior sidewall being arranged within the interior cavity; wherein the molding compound is formed around the lead-frame with the first die paddle arranged in the interior cavity, wherein the first and the second openings are aligned with one another so as to form a port that provides access to the interior cavity, and wherein the ridge and the interior sidewall collectively form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity. | ||
| 地址 | Neubiberg DE | ||