| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem, wherein transfers are increased yearly among computation LSIs and memories, improvement in traffic among the LSIs for operation and the memories and the reduction of power for communications are obtained and a method for laminating these LSIs and reducing communication distances is taken into account, but the security of heat-dissipating characteristics to increasing heat densities and the security of transmission-line characteristics for high-speed communications to the outside of laminated packages or the like are difficult in the simple lamination of the LSIs for operation and the memory LSIs, and a connection topology that improves communication performances among the laminated LSIs, while ensuring the general-purpose properties of the LSIs, also becomes necessary. <P>SOLUTION: External communication LSIs, the memory LSIs and the LSIs for operation are laminated in a semiconductor package in the order, and each LSI is connected by through-electrodes. Output terminals for a plurality of the LSIs are connected to the through-electrode input terminals for the laminated memory LSIs, and input terminals for a plurality of the LSIs laminated at the through-electrode output terminals for the laminated memory LSIs are connected, thus directly connecting both the external communication LSIs and the arithmetic LSIs to wirings for the memory LSIs. <P>COPYRIGHT: (C)2010,JPO&INPIT |
