| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with a solder BGA pad enabling an easy measurement of a solder thickness of the BGA pad on each wiring board and a method for measuring a thickness of a solder of the BGA pad.SOLUTION: A wiring board 10 is formed by depositing a BGA pad 5, composed of a solder on a surface of an insulating substrate 1, inside which a wiring conductor 2 is formed. On the surface of the insulating substrate 1, a plurality of dummy BGA pads 7, simultaneously deposited with the BGA pad 5, made of a solder, not connected to the wiring conductor 2 in the insulating substrate 1 and a band-shaped connection conductor 8, electrically connecting in series the plurality of dummy BGA pads are formed.SELECTED DRAWING: Figure 1 |
