| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with less deformation in a tape substrate of fan-out structure. <P>SOLUTION: The semiconductor device comprises a tape substrate 10, made of polyimide resin having a circuit pattern 16 at the rear surface, wherein a circumference 11b outside a part for surface central part 11a is formed thicker and a through-hole 21 is formed in the central part; a semiconductor chip 25 in which an electrode pad sequence 26 is exposed in the through-hole 21 which is laid in a part in the surface central part 11a of the tape substrate 10 in facedown manner; a bonding wire 28 which electrically connects the circuit pattern 16 to the electrode pad sequence 26; an external connection terminal 23 electrically connected to the circuit pattern 16 which is provided in the rear surface of the circumference 11b of the tape substrate 10; and a solder resist film 13 which is provided in the rear surface of the tape substrate 10, by exposing the external connection terminal 23. <P>COPYRIGHT: (C)2007,JPO&INPIT |
