发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting device capable of reducing the size of a device by simplifying the entire structure of the device and capable of reducing the number of parts to reduce the manufacturing cost.SOLUTION: There is provided a cutting device for holding a workpiece on a holding table by a carry-out/carry-in mechanism and cutting the workpiece held by first cutting means 5a and second cutting means 5b. The first cutting means and the second cutting means are movably supported on a Y-axis guide rail arranged along the Y-axis direction, and indexing feed means 54 is provided with a common Y-axis linear rail 540 arranged along the Y-axis guide rail, a first coil mover 544a movably fitted in the Y-axis linear rail and attached to a moving base 51 of the first cutting means, and a second coil mover 544b movably fitted in the Y-axis linear rail and attached to the moving base 51 of the second cutting means.SELECTED DRAWING: Figure 3
申请公布号 JP2016207987(A) 申请公布日期 2016.12.08
申请号 JP20150092100 申请日期 2015.04.28
申请人 DISCO ABRASIVE SYST LTD 发明人 OGAWARA SATOSHI;YAGIHARA JUN;TERASHI KENTARO;AKASE KATSUHIKO;MATSUOKA SHINTARO;TANAKA MANPEI
分类号 H01L21/301;B24B27/06;B24B41/06;B24B47/04;B24B47/12 主分类号 H01L21/301
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