发明名称 Systems and methods for conforming device testers to integrated circuit device with pressure relief valve
摘要 The present invention relates to systems and methods for preventing over pressurization in a fluid management system used in an integrated circuit (IC) device tester. The prevention of the over pressurization in the fluid management system is based on the use of a pressure relief valve coupled to the fluid management system.
申请公布号 US9383406(B2) 申请公布日期 2016.07.05
申请号 US201414525223 申请日期 2014.10.28
申请人 Essai, Inc. 发明人 Barabi Nasser;Ho Chee Wah;Tienzo Joven R.;Kryachek Oksana;Nazarov Elena V.
分类号 G01R19/32;G01R31/28;G01R1/04 主分类号 G01R19/32
代理机构 代理人 Lim Kang S.
主权项 1. An integrated circuit (IC) device tester configured to maintain a set point temperature on an IC device under test (DUT) having a die attached to a substrate, the tester comprising: a thermal control unit including: a pedestal assembly comprising a heat-conductive pedestal configured to contact the die of the DUT;a heat exchange plate facilitating the heat conduction to and from the heat-conductive pedestal and having an attached temperature sensor for monitoring the temperature;a temperature-control fluid circulation block having a fluid inlet and a fluid outlet configured to circulate a fluid therethrough, and wherein the fluid circulation block in stacked relationship along a z-axis with the heat conductive pedestal;a thermally-conductive heater configured to provide heat to the pedestal through the heat exchange plate;a substrate pusher configured to contact the substrate of the DUT;a controllable force distributor configured to receive a z-axis force and controllably distribute such z-axis force between the pedestal assembly and the substrate pusher;a fluid management system configured to supply the thermal control unit with fluids for pneumatic actuation, cooling, and condensation abating; anda pressure relief valve configured to relieve the pressure of the fluids in the thermal control unit.
地址 Fremont CA US