| 摘要 |
<p>A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn-Ag-Al alloy composition comprising (0.01-20) %Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Cu-Al alloy composition comprising (0.01-20)%Ag, (0.01-l)%Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Al-Ni composition comprising (0.01-20) %Ag, (0.01-2)%Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn-Ag-Cu-Al-Ni alloy composition comprising (0.01-20) %Ag, (0.01-l)%Cu, (0.01-2)%Al, (0.01-4)%Ni, balanced with Sn.</p> |
