Electronic component housing assembly and a method of its manufacture,申请号GB20070000120-传众专利搜索

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发明名称	Electronic component housing assembly and a method of its manufacture
摘要
申请公布号	GB2445378(B)	申请公布日期	2009.06.17
申请号	GB20070000120	申请日期	2007.01.04
申请人	MOTOROLA INC	发明人	YONATAN KEMELMAN;REUVEN-YOSEF FILMAN
分类号	H05K9/00	主分类号	H05K9/00
代理机构		代理人
主权项
地址

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