发明名称 半導体装置の作製方法
摘要 The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is formed on or in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.
申请公布号 JP6030714(B2) 申请公布日期 2016.11.24
申请号 JP20150122815 申请日期 2015.06.18
申请人 株式会社半導体エネルギー研究所 发明人 山崎 舜平;小山 潤;加藤 清
分类号 H01L21/8242;H01L27/108 主分类号 H01L21/8242
代理机构 代理人
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