发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of local temperature control while effectively activating impurities. SOLUTION: After a recess 8 is selectively formed on a surface of an optical absorption film 10, light is irradiated to the film 10 for heat treatment. A time period of the heat treatment is 1 second or shorter, for example. The heat treatment activates the impurities in an extension layer 5 and a pocket layer 6, but little heat dissipation occurs because the treatment continues for a short time. Since the surface of the optical absorption film 10 is flat in a low-temperature annealing region 51, the light reflected by the surface of the film 10 does not come again toward the film 10. On the other hand, in a high-temperature annealing region 52, the light irradiated inside the recess 8 is irradiated to the plane of the recess 8 a plurality of times with high probability, and then emitted outside. Therefore, a ratio absorbed by the optical absorption film 10 is remarkably higher than in the low-temperature annealing region 51. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008027988(A) 申请公布日期 2008.02.07
申请号 JP20060195976 申请日期 2006.07.18
申请人 FUJITSU LTD 发明人 KUBO TOMOHIRO
分类号 H01L21/265;H01L21/26;H01L21/8234;H01L27/088 主分类号 H01L21/265
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