发明名称 MANUFACTURING METHOD OF NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a nitride semiconductor light emitting device. <P>SOLUTION: The manufacturing method of a nitride semiconductor light emitting device comprises: a process for forming on a substrate a sacrificial layer with wet etching characteristics; a process for promoting epitaxial growth of a semiconductor layer formed on the protection layer which is formed on the sacrificial layer so as to protect the sacrificial layer under the reactive gas atmosphere for crystal growth; a process for forming a semiconductor device containing an n-type semiconductor layer, an active layer, and a p-type semiconductor layer on the protection layer; and a process for separating and removing the substrate from the semiconductor device, by carrying out wet etching of the sacrificial layer. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008047864(A) 申请公布日期 2008.02.28
申请号 JP20070136083 申请日期 2007.05.23
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 KIM KYOUNG-KOOK;CHOI KWANG-KI;SONG JUNE-O;YOON SUK-HO;BAIK KWANG-HYEON;KIM HYUN-SOO
分类号 H01L33/06;H01L33/32;H01L33/42 主分类号 H01L33/06
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