发明名称 |
MANUFACTURING METHOD OF NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a nitride semiconductor light emitting device. <P>SOLUTION: The manufacturing method of a nitride semiconductor light emitting device comprises: a process for forming on a substrate a sacrificial layer with wet etching characteristics; a process for promoting epitaxial growth of a semiconductor layer formed on the protection layer which is formed on the sacrificial layer so as to protect the sacrificial layer under the reactive gas atmosphere for crystal growth; a process for forming a semiconductor device containing an n-type semiconductor layer, an active layer, and a p-type semiconductor layer on the protection layer; and a process for separating and removing the substrate from the semiconductor device, by carrying out wet etching of the sacrificial layer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008047864(A) |
申请公布日期 |
2008.02.28 |
申请号 |
JP20070136083 |
申请日期 |
2007.05.23 |
申请人 |
SAMSUNG ELECTRO MECH CO LTD |
发明人 |
KIM KYOUNG-KOOK;CHOI KWANG-KI;SONG JUNE-O;YOON SUK-HO;BAIK KWANG-HYEON;KIM HYUN-SOO |
分类号 |
H01L33/06;H01L33/32;H01L33/42 |
主分类号 |
H01L33/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|