发明名称 |
Polisher for chemical mechanical planarization |
摘要 |
Embodiments of a polisher for chemical mechanical planarization. The polisher includes a polishing pad structure containing a first reactant therein, and a second reactant in a polishing environment over the polishing pad structure. The first reactant and the second reactant react endothermically upon contact when polishing a wafer surface between the polishing pad structure and the polishing environment.
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申请公布号 |
US2008233839(A1) |
申请公布日期 |
2008.09.25 |
申请号 |
US20070727119 |
申请日期 |
2007.03.23 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LU HSIN-HSIEN;CHEN LIANG-GUANG;BAO TIEN-I;SHUE SHAU-LIN |
分类号 |
C25F3/30 |
主分类号 |
C25F3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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