| 发明名称 |
METHOD OF MANUFACTURING MICRO PINS AND ISOLATED CONDUCTIVE MICRO PIN |
| 摘要 |
A method of manufacturing micro pins includes forming a release layer over a substrate. A pattern layer is formed over the release layer, in which the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer. A plurality of micro pins are respectively formed in the openings. The pattern layer and the release layer are removed to obtain the micro pins. An isolated conductive micro pin for connecting one or more components is also provided. |
| 申请公布号 |
US2016254239(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201514632654 |
申请日期 |
2015.02.26 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HUANG Ying-Jui;LIU Chung-Shi;LIAO Hsin-Hung;HWANG Chien-Ling |
| 分类号 |
H01L23/00;C25D1/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing micro pins, comprising:
forming a release layer over a substrate; forming a pattern layer over the release layer, wherein the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer; forming a plurality of micro pins respectively in the openings; and removing the pattern layer and the release layer to obtain the micro pins. |
| 地址 |
HSINCHU TW |
