发明名称 INTEGRATED DEVICE
摘要 PROBLEM TO BE SOLVED: To simplify wiring up to a memory, to prevent performance from degrading by an increase of an area and long distance wiring, and to increase a memory access speed. SOLUTION: An input and output port of a processing module PM, respective memory interfaces IF and respective memory banks are connected by connection wires wired in matrix (lattice) shape along a Y-direction (the first direction) and an X-direction (the second direction) in an arrangement area (upper layer thereof) for a plurality of memory macros. The connection wire includes multilayer wired instruction information wires (command address wire) and data wires, the instruction information wire is formed of a private wire (dedicated wire), and at least a second-directional wire is formed of a private wire, in the data wire. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008047079(A) 申请公布日期 2008.02.28
申请号 JP20060239096 申请日期 2006.09.04
申请人 SONY CORP 发明人 KASHIWATANI MOTOFUMI
分类号 G06F13/16;G06F12/00;G06F12/06 主分类号 G06F13/16
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