摘要 |
A device includes a conductive surface (12) and electrical contacts (14) by which an electric current is able to be passed. The electrical contacts (14) include conductive seeds (16) deposited on the conductive surface (12), an electrically insulating layer (18), which covers discontinuously the conductive seeds (16) in order to form openings leaving access to the conductive seeds (16), and a plating layer (22) recovering the discontinuous insulating layer (18) and deposited on conductive seeds (16) which are accessible through the openings and form points from which the deposit of the plating layer (22) can start. The rest of the conductive surface (12), which doesn't include any electrical contacts (14), is continuously covered by the electrically insulating layer (18). |
主权项 |
1. A solar cell comprising:
a conductive surface; and electrical contacts by which an electric current is able to be passed, the electrical contacts comprising
conductive seeds including a first plurality of conductive seeds and a second plurality of conductive seeds, the conductive seeds deposited on the conductive surface as a pattern of contact lines, the conductive seeds being made of a conductive paste containing particlesan electrically insulating layer discontinuously covering said conductive seeds forming openings leaving access to said conductive seeds, the electrically insulating layer directly covering a portion of each of the first plurality of conductive seeds, a remaining portion of each of the first plurality of conductive seeds corresponding to said openings in said electrically insulating layer are not directly covered by the electrically insulating layer, the second plurality of conductive seeds are not directly covered by the electrically insulating layer, anda plating layer covering said electrically insulating layer and deposited on the conductive seeds accessible through said openings, wherein the remaining portion of each of the first plurality of conductive seeds is in contact with said plating layer conductive seeds,the conductive surface, the conductive seeds, and the plating layer being in electrical contact, the conductive seeds being in electrical contact with the plating later, the plating layer being in electrical contact with the conductive surface, wherein a portion of the conductive surface that does not include any of the electrical contacts is continuously covered by said electrically insulating layer. |