发明名称 Device comprising electrical contacts and its production process
摘要 A device includes a conductive surface (12) and electrical contacts (14) by which an electric current is able to be passed. The electrical contacts (14) include conductive seeds (16) deposited on the conductive surface (12), an electrically insulating layer (18), which covers discontinuously the conductive seeds (16) in order to form openings leaving access to the conductive seeds (16), and a plating layer (22) recovering the discontinuous insulating layer (18) and deposited on conductive seeds (16) which are accessible through the openings and form points from which the deposit of the plating layer (22) can start. The rest of the conductive surface (12), which doesn't include any electrical contacts (14), is continuously covered by the electrically insulating layer (18).
申请公布号 US9437753(B2) 申请公布日期 2016.09.06
申请号 US201013501177 申请日期 2010.10.11
申请人 ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL) EPFL-TTO 发明人 Ballif Christophe
分类号 H01L31/0224;H01L31/05 主分类号 H01L31/0224
代理机构 Young & Thompson 代理人 Young & Thompson
主权项 1. A solar cell comprising: a conductive surface; and electrical contacts by which an electric current is able to be passed, the electrical contacts comprising conductive seeds including a first plurality of conductive seeds and a second plurality of conductive seeds, the conductive seeds deposited on the conductive surface as a pattern of contact lines, the conductive seeds being made of a conductive paste containing particlesan electrically insulating layer discontinuously covering said conductive seeds forming openings leaving access to said conductive seeds, the electrically insulating layer directly covering a portion of each of the first plurality of conductive seeds, a remaining portion of each of the first plurality of conductive seeds corresponding to said openings in said electrically insulating layer are not directly covered by the electrically insulating layer, the second plurality of conductive seeds are not directly covered by the electrically insulating layer, anda plating layer covering said electrically insulating layer and deposited on the conductive seeds accessible through said openings, wherein the remaining portion of each of the first plurality of conductive seeds is in contact with said plating layer conductive seeds,the conductive surface, the conductive seeds, and the plating layer being in electrical contact, the conductive seeds being in electrical contact with the plating later, the plating layer being in electrical contact with the conductive surface, wherein a portion of the conductive surface that does not include any of the electrical contacts is continuously covered by said electrically insulating layer.
地址 Lausanne CH