| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil laminate with an adhesive capable of manufacturing a copper-clad laminated plate and a printed circuit board without bringing about a wrinkle, a damage or the like on a copper foil layer and a method for manufacturing the same. SOLUTION: The copper foil laminate with the adhesive comprises an adhesive layer provided on one surface of a copper foil having a thickness of 10μm or less, and a protective layer made of a water soluble or water swelling resin film and provided on another surface in a structure. The method for manufacturing the copper foil laminate with the adhesive comprises the steps of forming the copper foil layer having a film thickness of 10μm or less on one surface of the water soluble or water swelling resin film, and then forming the adhesive layer on the formed copper foil layer.
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