发明名称 COPPER ALLOY POWDER FOR ELECTROCONDUCTIVE PASTE
摘要 A copper alloy powder for an electrically conductive paste is provided, which is characterized in that the copper alloy powder comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of one or two elements selected from the group consisting of Ta and W and has an average particle size of 0.1 to 1 mu m. This copper alloy powder has a higher starting temperature for sintering, higher oxidation resistance and better heat resistance than a copper powder. <IMAGE>
申请公布号 EP1454688(A4) 申请公布日期 2007.05.02
申请号 EP20020781852 申请日期 2002.11.28
申请人 KAWATETSU MINING CO., LTD. 发明人 MATSUKI, KENSUKE
分类号 B22F1/00;C22C1/04;C22C9/00;H01B1/00;H01B1/02;H01B1/22;H01G4/008;(IPC1-7):C22C1/04 主分类号 B22F1/00
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