发明名称 |
COPPER ALLOY POWDER FOR ELECTROCONDUCTIVE PASTE |
摘要 |
A copper alloy powder for an electrically conductive paste is provided, which is characterized in that the copper alloy powder comprises 80 to 99.9 mass % of Cu and 0.1 to 20 mass % of one or two elements selected from the group consisting of Ta and W and has an average particle size of 0.1 to 1 mu m. This copper alloy powder has a higher starting temperature for sintering, higher oxidation resistance and better heat resistance than a copper powder. <IMAGE> |
申请公布号 |
EP1454688(A4) |
申请公布日期 |
2007.05.02 |
申请号 |
EP20020781852 |
申请日期 |
2002.11.28 |
申请人 |
KAWATETSU MINING CO., LTD. |
发明人 |
MATSUKI, KENSUKE |
分类号 |
B22F1/00;C22C1/04;C22C9/00;H01B1/00;H01B1/02;H01B1/22;H01G4/008;(IPC1-7):C22C1/04 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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