SUBSTRATE PROCESSING APPARATUS, TEMPERATURE CONTROL PLATE, AND SUBSTRATE PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which prevents deterioration of throughput of substrate processing and enables partial substrate temperature control.SOLUTION: A COR processing device 14 serving as a substrate processing apparatus includes: a chamber 36 having a sealed structure; heaters 59 embedded in a ceiling part 41a and a side wall part 41b of a lid part 41 forming the chamber 36; and a stage 37 which is disposed in the chamber 36 and configured to place a wafer W thereon. A pattern disc 60 is disposed between the wafer W and the stage 37. Hard alumite treatment is partially performed in the pattern disc 60. The pattern disc 60 has a first thermal emissivity change region 60a and a thermal emissivity non-change region which have different thermal emissivity.SELECTED DRAWING: Figure 4