发明名称 CAPACITOR LAYER-FORMING MATERIAL AND PRINTED CIRCUIT BOARD HAVING INTERNAL CAPACITOR CIRCUIT OBTAINED BY USING CAPACITOR LAYER-FORMING MATERIAL
摘要 <p>The object is to provide a material for forming a capacitor layer which is excellent in adhesion within a dielectric layer and a bottom electrode of a capacitor circuit. And to provide a material for forming a capacitor layer which has a new conductive layer for forming a bottom electrode capable of being used as an electrode serving also as a resistance circuit and the like. To solve the problem, the invention provides a conductive layer in which a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer or a nickel-phosphorus alloy layer, a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer, to assure excellent adhesion within the bottom electrode of a capacitor circuit and the dielectric layer in a printed wiring board having a dielectric layer between an top electrode and a bottom electrode.</p>
申请公布号 EP1804558(A1) 申请公布日期 2007.07.04
申请号 EP20050782331 申请日期 2005.09.09
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 SUGIOKA, AKIKO;ABE, NAOHIKO
分类号 H05K1/16;H01L23/12;H05K3/46 主分类号 H05K1/16
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