发明名称 |
CAPACITOR LAYER-FORMING MATERIAL AND PRINTED CIRCUIT BOARD HAVING INTERNAL CAPACITOR CIRCUIT OBTAINED BY USING CAPACITOR LAYER-FORMING MATERIAL |
摘要 |
<p>The object is to provide a material for forming a capacitor layer which is excellent in adhesion within a dielectric layer and a bottom electrode of a capacitor circuit. And to provide a material for forming a capacitor layer which has a new conductive layer for forming a bottom electrode capable of being used as an electrode serving also as a resistance circuit and the like. To solve the problem, the invention provides a conductive layer in which a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer or a nickel-phosphorus alloy layer, a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer, to assure excellent adhesion within the bottom electrode of a capacitor circuit and the dielectric layer in a printed wiring board having a dielectric layer between an top electrode and a bottom electrode.</p> |
申请公布号 |
EP1804558(A1) |
申请公布日期 |
2007.07.04 |
申请号 |
EP20050782331 |
申请日期 |
2005.09.09 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
SUGIOKA, AKIKO;ABE, NAOHIKO |
分类号 |
H05K1/16;H01L23/12;H05K3/46 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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