| 发明名称 |
MULTI-LEVEL MICROMECHANICAL STRUCTURE |
| 摘要 |
The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer. |
| 申请公布号 |
US2016332864(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201615147197 |
申请日期 |
2016.05.05 |
| 申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
IIHOLA Antti;TORKKELI Altti;RYTKÖNEN Ville-Pekka;LIUKKU Matti |
| 分类号 |
B81B3/00;B81C1/00 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A micromechanical device, comprising:
a device layer comprising only homogenous device wafer material, wherein the device layer comprises a multi-level comb structure having at least a rotor and at least two stators. |
| 地址 |
Nagaokakyo-shi JP |
