| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A semiconductor device comprises: die pads 3a, 3h on which semiconductor chips 1, 2 are mounted, respectively; a plurality of support pins for supporting the die pads 3a, 3h, respectively; a plurality of inner leads 3b and a plurality of outer leads 3c which are arranged around the die pads 3a, 3h; a plurality of wires 6 for electrically connecting the semiconductor chips 1, 2 and the plurality of inner leads 3b; and an encapsulation body 4 for encapsulating the semiconductor chips 1, 2, the plurality of inner leads 3b and the plurality of wires 6. Each of the die pads 3a, 3h is supported by three support pins integrally formed with each die pad. Each of the second support pins 3e, 3j among the respective three support pins is arranged between the inner leads 3b which lie next to each other. |
