发明名称 DENTAL IMPLANT KIT AND METHOD OF USING SAME
摘要 Dental implant kits and methods of installing the dental implant kit into a bone are provided. The kits and methods make us of a housing understructure having opposing electrodes for providing a therapeutic electrical signal across the electrodes in order to promote the health and accelerate the healing of the implanted housing understructure in bone. The dental implant kit also has a closure unit configured to be attached to the housing understructure that provides the electrical energy required to drive the therapeutic electrical signal. An optional abutment unit is also described that also provides the electrical energy to drive the therapeutic electrical signal. The method includes the steps of cementing, combining, cutting, extricating, installing, joining, linking, obtaining, opening, reaming, releasing, removing, sewing, and testing.
申请公布号 US2008171304(A1) 申请公布日期 2008.07.17
申请号 US20070622213 申请日期 2007.01.11
申请人 MCGINNIS WILLIAM J;METRICK SCOTT A 发明人 MCGINNIS WILLIAM J.;METRICK SCOTT A.
分类号 A61C8/00 主分类号 A61C8/00
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