| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing method in which a wafer is irradiated with laser beam of a wavelength with absorptivity along a schedule division line of the wafer so as to completely divide the wafer, and which can prevent an adhesive tape from melting so that the adhesive tape may adhere to a chuck table.SOLUTION: A processing method, by which a processed groove is formed in a plate-like object by a laser processing device, performs: a step of adhering, to an annular frame, an adhesive tape, in which an adhesive layer 21 is laminated on one surface of a base material film 19 and a function layer 23, which includes metal oxide particulates, emulsion particles of thermoplastic resin as a binding agent and dispersed media, is laminated on the other surface of the film, and adhering the plate-like object positioned at an opening part to the adhesive tape to support the object; a step of placing and holding the plate-like object on a chuck table; and a step of processing and feeding the chuck table and laser beam irradiating means using processing/feeding means to form a laser-processed groove.SELECTED DRAWING: Figure 3 |
