发明名称 |
Method for manufacturing liquid jetting apparatus and liquid jetting apparatus |
摘要 |
A method for manufacturing a liquid jetting apparatus, which is provided with: a flow passage formation member including a pressure chamber, and a piezoelectric actuator having a vibration film provided on the flow passage formation member, a piezoelectric film arranged on the vibration film to correspond to the pressure chamber, first and second electrodes arranged on different surfaces of the piezoelectric film, a first protective film covering the piezoelectric film, a wire connected to the second electrode, and a second protective film covering the wire, includes: forming a first protective film on the vibration film to cover the piezoelectric film and the second electrode; forming the wire and the second protective film to cover the wire with the first protective film covering the piezoelectric film and the second electrode; and removing a part, of the first protective film, that overlaps with the second electrode, after forming the second protective film. |
申请公布号 |
US9434163(B2) |
申请公布日期 |
2016.09.06 |
申请号 |
US201514806829 |
申请日期 |
2015.07.23 |
申请人 |
Brother Kogyo Kabushiki Kaisha |
发明人 |
Hirai Keita |
分类号 |
B41J2/045;B21D53/76;B23P17/00;B41J2/14;B41J2/16 |
主分类号 |
B41J2/045 |
代理机构 |
Frommer Lawrence & Haug LLP |
代理人 |
Frommer Lawrence & Haug LLP |
主权项 |
1. A method for manufacturing a liquid jetting apparatus;
wherein the liquid jetting apparatus includes:
a flow passage formation member in which a pressure chamber is formed to communicate with a nozzle; anda piezoelectric actuator having;
a vibration film provided on the flow passage formation member to cover the pressure chamber;a piezoelectric film arranged on the vibration film to correspond to the pressure chamber;a first electrode arranged on a surface of the piezoelectric film on a side near to the vibration film;a second electrode arranged on another surface of the piezoelectric film on a side far from the vibration film;a first protective film covering the piezoelectric film;a wire connected to the second electrode; anda second protective film covering the wire; wherein the method comprises:
a first protective film formation step of forming the first protective film on the vibration film to cover the piezoelectric film and the second electrode;a wire formation step of forming the wire;a second protective film formation step of forming the second protective film to cover the wire in a state of the first protective film covering the piezoelectric film and the second electrode; anda first removal step of removing a part, of the first protective film, that overlaps with the second electrode, after the second protective film formation step, so that part of the second electrode is exposed. |
地址 |
Aichi-ken JP |