发明名称 Method for manufacturing liquid jetting apparatus and liquid jetting apparatus
摘要 A method for manufacturing a liquid jetting apparatus, which is provided with: a flow passage formation member including a pressure chamber, and a piezoelectric actuator having a vibration film provided on the flow passage formation member, a piezoelectric film arranged on the vibration film to correspond to the pressure chamber, first and second electrodes arranged on different surfaces of the piezoelectric film, a first protective film covering the piezoelectric film, a wire connected to the second electrode, and a second protective film covering the wire, includes: forming a first protective film on the vibration film to cover the piezoelectric film and the second electrode; forming the wire and the second protective film to cover the wire with the first protective film covering the piezoelectric film and the second electrode; and removing a part, of the first protective film, that overlaps with the second electrode, after forming the second protective film.
申请公布号 US9434163(B2) 申请公布日期 2016.09.06
申请号 US201514806829 申请日期 2015.07.23
申请人 Brother Kogyo Kabushiki Kaisha 发明人 Hirai Keita
分类号 B41J2/045;B21D53/76;B23P17/00;B41J2/14;B41J2/16 主分类号 B41J2/045
代理机构 Frommer Lawrence & Haug LLP 代理人 Frommer Lawrence & Haug LLP
主权项 1. A method for manufacturing a liquid jetting apparatus; wherein the liquid jetting apparatus includes: a flow passage formation member in which a pressure chamber is formed to communicate with a nozzle; anda piezoelectric actuator having; a vibration film provided on the flow passage formation member to cover the pressure chamber;a piezoelectric film arranged on the vibration film to correspond to the pressure chamber;a first electrode arranged on a surface of the piezoelectric film on a side near to the vibration film;a second electrode arranged on another surface of the piezoelectric film on a side far from the vibration film;a first protective film covering the piezoelectric film;a wire connected to the second electrode; anda second protective film covering the wire; wherein the method comprises: a first protective film formation step of forming the first protective film on the vibration film to cover the piezoelectric film and the second electrode;a wire formation step of forming the wire;a second protective film formation step of forming the second protective film to cover the wire in a state of the first protective film covering the piezoelectric film and the second electrode; anda first removal step of removing a part, of the first protective film, that overlaps with the second electrode, after the second protective film formation step, so that part of the second electrode is exposed.
地址 Aichi-ken JP