| 摘要 |
PURPOSE:To realize one side face light source convenient for its operation and having a large light quantity by dispersively mounting a plurality of LED elements at a predetermined interval on a circuit board provided in close contact with a mounting board having high thermal conductivity. CONSTITUTION:Circuit boards 4 made of ceramics are secured to both side faces of a mounting board 1 via sheet members 3 such as silicone rubber, etc., having high thermal conductivity and elasticity. Buffer properties and adhesive properties between the boards 1 and 4 are obtained. LED chips 5 are respectively mounted in recesses formed on the board 4. Convex lenses 6 are arranged on the front faces of the chips 5 to provide directionality in light emissions. Heats generated from the elements 6 can be efficiently dissipated via heat sink fins 2 during a light emitting operation. |
