BORON NITRIDE AGGREGATED PARTICLE, METHOD FOR PRODUCING BORON NITRIDE AGGREGATED PARTICLE, RESIN COMPOSITION CONTAINING BORON NITRIDE AGGREGATED PARTICLE, AND MOLDING

摘要

PROBLEM TO BE SOLVED: To provide boron nitride aggregated particles which are suitable as a thermally conductive filler for a heat-radiation sheet of a power semiconductor device, and are excellent in isotropy of thermal conductivity, disintegration resistance and kneading property with resin.SOLUTION: Boron nitride aggregated particles (hereinafter referred to as "BN aggregated particles") are formed by aggregating boron nitride primary particles (hereinafter referred to as "BN primary particles"). A peak area intensity ratio ((100)/(004)) of a (100) plane and a (004) plane of the BN primary particles is 0.25 or more which is obtained by measuring a pellet-like sample obtained by molding at a molding pressure of 0.85 ton/cmor more and 2.54 ton/cmor less with a powder tablet molding machine of 10 mmφ, with powder X-ray diffraction. An average crystallite size of the BN primary particles is 375 Å or more which is determined from the peak of a (002) plane of the BN primary particles that fills a glass sample plate with a depth of 0.2 mm with the BN aggregated particles so that its surface becomes smooth and is obtained by measuring the BN aggregated particles with the powder X-ray diffraction.SELECTED DRAWING: None