发明名称 Variable resistance memory device and method of manufacturing the same
摘要 A variable resistance memory device and a method of manufacturing the same are provided. The variable resistance memory device includes a multi-layered insulating layer including a plurality of holes formed on a semiconductor substrate, a lower electrode formed in a bottom of each of the holes, a first spacer formed on the lower electrode and a sidewall of each of the holes, a second spacer formed on an upper sidewall of the first spacer, a third spacer formed on a lower sidewall of the first spacer below the second spacer, a variable resistance part that is formed on the lower electrode has a height lower than a height of a top of each hole, and an upper electrode formed on the variable resistance part to be buried in each hole.
申请公布号 US8933430(B1) 申请公布日期 2015.01.13
申请号 US201314044367 申请日期 2013.10.02
申请人 SK Hynix Inc. 发明人 Jung Ha Chang;Lee Gi A
分类号 H01L47/00;H01L45/00 主分类号 H01L47/00
代理机构 IP & T Group LLP 代理人 IP & T Group LLP
主权项 1. A method of manufacturing a variable resistance memory device, the method comprising: forming a multi-layered insulating layer on a semiconductor substrate; forming a hole exposing a portion of an upper surface of the semiconductor substrate by etching the multi-layered insulating layer; forming a lower electrode in a bottom of the hole; forming a first spacer on the lower electrode and a sidewall of the hole; forming a second spacer on an upper sidewall of the first spacer; forming a third spacer on a lower sidewall of the first spacer; forming a variable resistance part in the hole to have a height lower than that of the hole; and forming an upper electrode on the variable resistance part to be buried in the hole.
地址 Gyeonggi-do KR