| 摘要 |
<p>It is intended to provide a method of forming an electrical wiring, in which a paste material containing metal nanoparticles, a binder comprising an organic compound is applied on an insulating substrate thereby to form a pattern portion for wiring. Then, on the pattern portion formed with the paste material, oxygen radical molecules are sprayed. By this spraying of oxygen radical molecules, the organic compound in the binder is oxidized and released in the atmosphere, and then the metal nanoparticles directly come into contact with one another, whereby sintering occurs due to the resulting high surface energy. By the sintering due to the mutual contact of metal nanoparticles, a conductive portion is formed on the insulating substrate.</p> |
