SEMICONDUCTOR PACKAGE WITH HEAT EMISSION STRUCTURE AND METHOD OF PACKAGING THE SAME

摘要

A semiconductor package of a structure of discharging heat and a method for packaging this are provided to improve efficiency for heat dissipation as a radiating unit of a metal material is included in a upper side of a molding unit and heat generated in a semiconductor IC chip and a plurality of active elements and passive elements is emitted to outside. A semiconductor package comprises a substrate(100), a molding unit(150), and a radiating unit(161). One or more heat generation element is set up in the upper side of the substrate. The molding unit covers the substrate including the heat generation element. The radiating unit is a metal material made of a plurality of unevenness surfaces and even adsorption surfaces(162) in the upper side of the molding unit. The heat generated in the heat generation element is released through the radiating unit to outside.