OPTICAL SENSOR DEVICE

摘要

A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.

主权项

1. A package body for an optical sensor element, comprising:
a first resin molded portion having embedded therein a part of each of a plurality of leads; and a second resin molded portion molded over at least a portion of the first resin molded portion and having embedded therein a part of each of the plurality of leads situated on an outer side of the first resin molded portion, wherein a cavity is provided in the second resin molded portion or jointly in the first and second resin molded portions, the cavity having a bottom portion the center of which is formed of the second resin molded portion, the second resin molded portion has a mounting portion for mounting thereon the optical sensor element, the mounting portion being formed at the center of the cavity bottom portion, and each of the plurality of leads has an inner end portion apart of which is exposed within the cavity, and an outer end portion that extends outside the second resin molded portion.