| 发明名称 |
SUBSTRATE STRUCTURE |
| 摘要 |
A substrate structure includes: a substrate body defined with a layout area, a sealing member and a cutting area, the sealing member being adjacent to the layout area, and the cutting area being adjacent to the sealing member; a wiring layer formed on the layout area; an insulating layer formed on the layout area and the wiring layer; and a metal layer formed on the insulating layer and the layout area. The insulating layer is prevented from being delaminated due to the formation of the metal layer. |
| 申请公布号 |
US2016190039(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514879254 |
申请日期 |
2015.10.09 |
| 申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Chang Cheng-An;Sun Sung-Huan;Wu Chien-Hung;Chen Yi-Cheih;Liao Wen-Kai |
| 分类号 |
H01L23/48;H01L23/528;H01L23/31;H01L23/498;H01L23/00 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate structure, comprising:
a substrate body having a sealing member and being defined with at least one layout area and a cutting area, wherein the sealing member is adjacent to the layout area, and the cutting area is adjacent to the sealing member such that the sealing member is positioned between the layout area and the cutting area; a wiring layer formed on a first portion of a surface of the layout area of the substrate body; an insulating layer formed on the wiring layer and on a second portion of the surface of the layout area of the substrate body; and a metal layer formed on the insulating layer and on a third portion of the surface of the layout area of the substrate body. |
| 地址 |
Taichung TW |
