发明名称 ヘッドホンポート出口の結合及び防水加工
摘要 A plate attached to the back shell of an earphone includes an exit cavity corresponding in dimension to and aligned with a first opening through the back shell. A channel in the bottom surface of the plate begins at a point aligned with a second opening through the back shell and ends at an aperture through a side wall of the exit cavity. The channel and the outer surface of the back shell together form a reactive acoustic port from a back cavity enclosed by the back shell to the exit cavity, the first opening through the shell forms a resistive acoustic port from the back cavity to the exit cavity, and the exit cavity couples the reactive acoustic port and the resistive acoustic port to free space without introducing additional acoustic impedance. In some examples, a water-resistant screen covers the upper aperture of the exit cavity.
申请公布号 JP6055102(B2) 申请公布日期 2016.12.27
申请号 JP20150531135 申请日期 2013.08.30
申请人 ボーズ・コーポレーションBOSE CORPORATION 发明人 スティーヴン・ディ・ボイル;ケネス・ディ・ギャニオン;ジョナサン・エー・クヌーセン;ウィリアム・タイス;ケヴィン・ジェイ・ウィンター
分类号 H04R1/10;H04R1/00 主分类号 H04R1/10
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