CHIP ON FLEX OPTICAL SUBASSEMBLY

摘要

One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.

主权项

1. An optical subassembly comprising:
a flex circuit; an optical port that defines a fiber receiver and a barrel cavity, the optical port being mechanically coupled to the flex circuit at a flex connection on a first surface of the flex circuit; an active optical subassembly positioned within the barrel cavity and located on the first surface of the flex circuit, wherein the active optical subassembly includes at least one active optical component that is mechanically coupled directly to the flex circuit and being aligned relative to the fiber receiver; and a heat sink stiffener located on a second surface of the flex circuit opposite the active optical component subassembly, the heat sink stiffener being configured to stiffen a portion of the flex circuit that includes the flex connection and act as a thermal sink for at least a portion of heat generated during operation of the active optical subassembly.