发明名称 MANUFACTURING METHOD OF CONNECTING MEMBER, AND CONNECTING MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a connecting member capable of preventing occurrence of leakage or the like even in a microcircuitry pattern and capable of inexpensively and easily manufacturing the connecting member excellent in conductivity. SOLUTION: The manufacturing method of the connecting member is composed of a pattern forming process for forming a pattern made of a silane coupling agent having an NH group or an NH<SB>2</SB>group on the substrate surface by printing, a photocurable compound and/or a thermosetting compound, and the photocurable compound and/or thermosetting compound containing a photocuring agent and/or heat curing agent, a resin particle adhering process for adhering resin particles surface-treated with the silane coupling agent having the NH group or the NH<SB>2</SB>group onto the pattern, a resin particle fixing process for fixing the resin particles onto the pattern by irradiating light to the pattern and/or heating the pattern, and an undercoat plating process for forming an undercoat plating layer by adhering an undercoat plating metal salt solution onto the pattern surface and the resin particle surface. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008210585(A) 申请公布日期 2008.09.11
申请号 JP20070044516 申请日期 2007.02.23
申请人 SEKISUI CHEM CO LTD 发明人 UENOYAMA SHINYA
分类号 H01R11/01;H01L21/60;H01L23/12;H01R43/00;H05K3/18 主分类号 H01R11/01
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