| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology of preventing a module board from causing defective sealing and improper mount or the like because a via conductor part of the board is prone to ruggedness even when the board is sintered while suppressing the contraction characteristic in mounting a surface acoustic wave element on one side of the board. <P>SOLUTION: The surface acoustic wave element formed by adhering an interdigital electrode 12, at least a pair of input/output terminals, a ring shaped ground terminal 13 in a way of surrounding the interdigital electrode 12 and the input/output terminals onto a rear side of a dielectric board is mounted on the module board, which is configured with a ceramic insulation board 1 formed by laminating a plurality of insulation layers, flat conductor layers formed on the front side and the inside of the insulation board, and the via conductor formed by filling and sintering a metal formed by being penetrated through the insulation layer. Input and output electrodes and a ring shaped ground electrode 15 connected to each terminal of the surface acoustic wave element are formed on the front side of the insulation board and the via conductor 14a is not directly connected to the input and the output electrodes and the ring shaped ground electrode 15. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
