| 摘要 |
PROBLEM TO BE SOLVED: To provide a new electronic component mounting method capable of raising precision in the mounting position and posture of an electronic component, dealing with high-density mounting, and securing sufficient mounting strength. SOLUTION: By the electronic component mounting method, the electronic component 4 is mounted on a connection terminal 2 via a conductive material 3. The method includes a component arrangement process of arranging the component terminal 4a of the electronic component on the connection terminal via the conductive material; a conductive material thinning process of temporarily thinning the softened conductive material, by pressurizing the electronic component to the side of the connection terminal; a conductive material thickening process (a) of thickening the temporarily thinned conductive material, by reducing or releasing pressure force between the electronic component and the connection terminal; and a conductive material hardening process (b) of hardening the thickened conductive material. COPYRIGHT: (C)2007,JPO&INPIT
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