Method for manufacturing compound material wafers and method for recycling a used donor substrate
摘要
<p>The invention relates to a method for manufacturing compound material wafers comprising the steps and a method for recycling donor substrates obtained in a method for manufacturing compound material wafers, wherein in order to improve the recycling rate of the donor substrate, at least one thermal treatment step configured to at least partially reduce oxygen precipitates and/or nuclei is carried out.</p>
申请公布号
EP1835533(A1)
申请公布日期
2007.09.19
申请号
EP20060290421
申请日期
2006.03.14
申请人
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
发明人
DELPRAT, DANIEL;NEYRET, ERIC;KONONCHUK, OLEG;REYNAUD, PATRICK;STINCO, MICHAEL