| 摘要 |
Provided are a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method, whereby warping of a semiconductor wafer due to a temperature difference between a placing surface of a table and the semiconductor wafer can be suppressed. A prober (10) of the present invention heats, in a preheating step wherein an oven (54) is used, a semiconductor wafer W to a second temperature that is equal to or lower than a first temperature, and then places the semiconductor wafer W on a placing surface (18) of a table (20) heated to the first temperature. Consequently, since a temperature difference between the placing surface (18) of the table (20) and the semiconductor wafer W is reduced, the prober (10) can suppress semiconductor wafer warping generated just after the semiconductor wafer is placed on the placing surface (18). |
