| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-like adhesive for semiconductor bonding with excellent bonding reliability, which has high adhesive strength immediately after curing and is capable of suppressing deterioration in adhesive strength after a high-temperature and high-humidity test.SOLUTION: The film-like adhesive for semiconductor bonding has an adhesive layer which contains a prepolymer having an allyl group and a compound having a (meth)acrylic group. The content of the prepolymer having an allyl group is 40 pts.wt. or more based on 100 pts.wt. of the total of the prepolymer having an allyl group and the compound having a (meth)acrylic group. The adhesive layer contains a coupling agent and an inorganic filler and does not contain a curing agent.SELECTED DRAWING: None |
