| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor module having both high heat radiation performance and high durability over a thermal stock cycle, and a circuit board used therefor. SOLUTION: In this semiconductor module 1, a circuit board 2 is joined to a semiconductor chip 3 via a first solder layer 4. The circuit board 2 consists of a ceramic board 5, a metal circuit boards 6 joined to both sides thereof and a metal heat radiation plate 7. In this semiconductor module 1, the thickness of a second solder layer 9 is reduced in the center of the metal heat radiation plate 7 and increased on its end. COPYRIGHT: (C)2008,JPO&INPIT |
