| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip mounting method of metal bonding all of copper bumps of all semiconductor chips to copper electrodes of a substrate by ultrasonic bonding when flip-chip mounting the semiconductor chips each having copper bumps to the substrate having the copper electrodes.SOLUTION: A semiconductor chip mounting method of flip-chip mounting semiconductor chips each having copper bumps to a substrate having copper electrodes comprises: a plasma treatment process of performing a plasma treatment on the copper bumps and the copper electrodes in an inert gas; and an ultrasonic bonding process of pressing the semiconductor chips to the substrate and causing a vibration in a state where tips of the copper bumps and the copper electrodes contact each other in an opposing manner after the plasma treatment process. In the ultrasonic bonding process, an oxygen concentration of an atmosphere including contact surfaces of the copper bumps and the copper electrodes is set at 3% or lower.SELECTED DRAWING: Figure 2 |
