| 摘要 |
PROBLEM TO BE SOLVED: To bond substrates with each other while properly holding the substrates.SOLUTION: A bonding device has: an upper chuck 140 on an undersurface, for vacuuming an upper wafer Wto hold the upper wafer Wby suction; and a lower chuck provided on a top face and under the upper chuck 140, for vacuuming a lower wafer to hold the lower wafer by suction. The upper chuck 140 has: a body part 170; a plurality of suction parts 172, 173 which are provided on an undersurface of the body part 170 and contact the upper wafer Wfor vacuuming the upper wafer Wto hold the upper wafer Wby suction; and a plurality of pins 171 provided on a portion of an undersurface of the body part 170 other than the plurality of suction parts 172, 173 and contact the upper wafer W.SELECTED DRAWING: Figure 8 |
