| 摘要 |
<P>PROBLEM TO BE SOLVED: To promote the enhancement of reliability accompanied by an increase in adhesive strength, the enhancement of workability, reduction in material cost and reduction in plant and equipment investment without using an anisotropic conductive film. <P>SOLUTION: In a mounting structure of a camera module 1, the camera module 1 is incorporated in a flexible wiring board 3. A connection land 4 arranged and formed on the flexible wiring board 3 and a connection land 2 arranged and formed at the camera module 1 are adjacently disposed, and the connection land 2 is connected to the connection land 4 by solder 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
