| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film having improved thermal shrinkability and simultaneously having improved adhesiveness. SOLUTION: This polyimide film comprising (1) a polyimide obtained from 1,4-phenylenediamine, 4,4'-diaminodiphenyl ether, pyromellitic dianhydride, and 3,3',4,4'-biphenyltetracarboxylic dianhydride, and (2) inorganic particles having particle diameters of 0.01 to 1.5μm and an average particle diameter of 0.05 to 0.7μm in an amount of 0.1 to 0.9 wt.% based on the weight of the polyamic acid is characterized by having a surface free energy of≥80 mN/m, when the polyimide film is sequentially subjected to a discharge treatment and a heating treatment in a state constantly keeping the longitudinal tension of the film and then measured on the basis of a contact angle method, and further having a thermal shrinkage degree of≤0.10% at 200°C for one hour. COPYRIGHT: (C)2008,JPO&INPIT
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