| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-reliability semiconductor device, and its manufacturing method. SOLUTION: The semiconductor device manufacturing method includes a step for preparing a wiring substrate 10 including a substrate 12, and a wiring pattern 18 that is formed on the surface of the substrate 12 while having each electrical-connection part 20; a step for mounting a semiconductor chip 30 having each bump 32 onto the wiring substrate 10, so as to electrically connect each electrical-connection part 20 with each bump 32 while making them face each other; and a step for forming a sealing resin 40 between the wiring substrate 10 and the semiconductor chip 30. In the step for mounting the semiconductor chip 30 onto the wiring substrate 10, each electrical connector 20 is pressed toward the substrate 12 by each bump 32, so as to bury a part of each electrical connector 20 into the substrate 12, and the substrate 12 is deformed so that the substrate 12 covers at least each base end of each side-face 24 of each electrical connector 20. COPYRIGHT: (C)2008,JPO&INPIT
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